Solar Photovoltaic Industry Chain Terminology-Solar Wafer-II
Wafer link in solar materials overview
In the production process of solar energy materials, the silicon wafer link is a crucial part of the photovoltaic industry chain. Silicon wafers are obtained by cutting silicon ingots into thin wafers, which are the basic materials for solar cells.
Carbon-based composites
Carbon fiber as the reinforcing body, carbon or silicon carbide, etc. as the matrix, chemical vapor deposition or liquid phase impregnation and other processes to form the composite material, mainly including carbon / carbon composite products (carbon fiber reinforced matrix carbon), carbon / ceramic composite products (carbon fiber reinforced silicon carbide) and so on.
Carbon fiber
High-strength, high-modulus fibers containing more than 90% carbon, made from acrylic, asphalt or viscose fibers by high-temperature oxidation and carbonization.
Carbon fiber pre-fabricated body (mat, blank)
Carbon fiber as the raw material, through the carbon fiber mesh, weaving, cloth mesh composite molding and other technologies formed by the blanks
Carbon/Carbon (C/C) Composites
High-performance composites formed by carbon fibers and their fabrics reinforcing the carbon matrix.
Isostatic graphite
Graphite materials produced by isostatic pressure molding.
Powder Metallurgy Materials
Porous, semi-dense or fully dense materials (including products) produced by powder metallurgical process
CVD, Chemical Vapor Deposition
A process that utilizes gaseous materials to produce solid materials through chemical reactions at high temperatures, and is a method of preparing carbon-based composites
Straight drawing method (CZ method)
The straight pull method, also known as the Czochralski method, is a crystal growth method established by Czochralski in 1918, referred to as the CZ method. the CZ method is characterized by melting polycrystalline silicon material contained in a high-purity quartz crucible in a straight thermal system heated by graphite resistance, and inserting the seed crystals into the surface of the melt for fusion bonding, while rotating the seed crystals and then Reversing the crucible, the seed crystal is slowly lifted upwards, and single crystal rods are grown through the processes of crystal introduction, shoulder release, shoulder rotation, isodiametric growth, and tailing.
Zone melting (FZ method)
Vertical suspension zone melting method, a section of rod material (such as semiconductor materials, metals, etc.) is fixed vertically, and a section of it is heated by high-frequency induction or other methods to make a section of the area melt, and the melt is suspended by surface tension support. The rod material or heater is moved vertically to move the melting zone, and the material in the area where the melting zone has moved is cooled and born as a single crystal. High purity single crystals can be obtained by the zone melting method.
Monocrystalline Silicon Growth Furnace
Under vacuum and inert gas protection, through the graphite resistance heater to melt polysilicon raw material heating, and then use the straight pull method to grow single crystal equipment, also known as “single crystal growth furnace” or “single crystal furnace”.
Zone melting furnace
A high-purity monocrystalline silicon rod growth equipment for suspension zone melting purification and single crystal growth, also known as “silicon single crystal zone melting furnace”, “zone melting silicon single crystal furnace”.
Monocrystalline silicon rods
Polysilicon raw material melting, straight drawing method or zone melting method from the melt to grow a rod of monocrystalline silicon.
Semiconductor monocrystalline silicon rounding machine
Fully automated integrated processing equipment that rounds and grinds semiconductor silicon rods to produce semiconductor silicon round rods that meet certain requirements for dimensional accuracy and surface roughness.
Semiconductor silicon single crystal silicon cutting machine
Fully-automatic integrated processing equipment that cuts off the head and tail of semiconductor silicon single crystal rods, cuts off the body, cuts off samples, and ultimately cuts off semiconductor silicon segments to meet certain requirements for dimensional accuracy and surface roughness.
Silicon wafer polishing machine
A machine that polishes the surface of silicon wafers by chemical reaction and mechanical action using a polishing solution.
Silicon wafer lapping machine
A machine that mechanically grinds the surface of cut silicon wafers using abrasive materials.
Monocrystalline silicon rod cutting and grinding composite processing machine
This machine is a fully automatic composite processing machine for cutting and grinding silicon single crystal rods by removing the edge skin around the rods, and then grinding the curved and flat surfaces, and finally processing the square rods to meet the requirements of certain dimensional accuracy and surface roughness.
Single wire cut-off machine adopts diamond wire cutting to cut off silicon single crystal rods, which can be used for cutting head and tail, cutting samples and equal length batch cut-off cutting processing equipment.
Polysilicon Ingot Casting Furnace
Equipment for growing polysilicon ingots by directional solidification under vacuum and inert gas protection by heating and melting the polysilicon raw material with a graphite resistance heater, and then in a strictly controlled temperature field.
Polysilicon Ingot
Ingots of polysilicon grown by directional solidification after melting of the polysilicon feedstock.
Polysilicon block chamfering and surface grinding machine
This is a fully automatic chamfering and grinding machine for grinding polysilicon blocks on all four sides to produce square rods that meet certain requirements for dimensional accuracy and surface roughness.
Polysilicon block grinding machine
Compound processing equipment for grinding the plane of polysilicon block and chamfering the 4 corners of the block.
Silicon Block Single Wire Cutting Machine
Adopting diamond wire cutting technology to remove the head and tail of polysilicon blocks, and realizing fully automatic processing equipment for 40 polysilicon blocks at the same time.
Diamond Wire
Cutting wire with diamond particles embedded in the surface of steel wire.
Diamond Wire Cut Wafer Technology
A cutting technology in which diamonds are bonded and plated to straight wires for high-speed round-trip cutting of silicon rods to produce silicon wafers.
Silicon wafer
A square or octagonal wafer formed by cutting monocrystalline silicon rods or polycrystalline silicon ingots.
Crystalline Silicon
Crystalline silicon material, including polycrystalline silicon, monocrystalline silicon, etc.
Monocrystalline silicon
Monocrystalline silicon in which the silicon atoms in the whole silicon crystal are arranged in a periodic manner, and which is obtained by using high-purity polysilicon as the raw material, mainly through the direct-drawing method and zone-melting method.
P-type monocrystalline silicon
In the production process of monocrystalline silicon doped with trivalent elements (e.g. boron), so that it replaces the silicon atoms to form P-type monocrystalline silicon.
N-type monocrystalline silicon
Doping of pentavalent elements (e.g. phosphorus) in the production of monocrystalline silicon to replace silicon atoms to form N-type monocrystalline silicon.
Polished wafers
Silicon wafers that are cut and ground and then polished.
In conclusion, the silicon wafer segment plays a critical role in the photovoltaic industry, with its quality and characteristics significantly affecting the overall performance and competitiveness of solar energy products. Therefore, maintaining high standards throughout the production process is essential for achieving optimal results in solar technology.
Next time we'll look at the “Solar cells and solar system Kits".
Featured Products
Follow us ! TEEJOIN SOLAR
